Manufacturing Technology Today

S. N. Ram ¹, Jaspreet Singh ¹, G. Jagadeesh ¹, M. M. Nayak ², K. Nagachenchaiah ²

Affiliations
1 Dept. of Aerospace Engg, Indian Institute of Science, Bangalore, IN
2 Indian Space Research Organisation, Dept. of Space, Bangalore, IN

Abstract

This paper reports on development of MEMS based pressure sensors arrays for static pressure measurement on aerodynamic surfaces. The two different types of sensors arrays with cluster of 25 sensors and 5 sensors are developed. The characterization of pressure sensors arrays carried out in static condition and the working of sensors has been demonstrated for hypersonic flows in shock tunnel with the cluster of 5 sensors array. The static pressure measured using the MEMS sensors in shock tunnel testing are in good agreement with conventional Kulite sensors.

Keywords

Pressure Measurements, MEMS Sensors, Hypersonic Flow, Pressure Sensor.

Full Text

     

Manoj Kandpal ¹, Megha Dass ², Jaspreet Singh ¹, Satya Narayan Behera ¹

Affiliations
1 MEMS Fabrication Division, Semi-Conductor Laboratory Mohali, IN
2 Indian Institute of Technology, Kanpur, IN

Abstract

The uses of metal thin films are versatile and very well established in the field of CMOS and MEMS devices. Although, today’s many system manufacturing units provides facility to control the physical parameters such as thickness uniformity and deposition rate. However, the impact of tool parameters must be optimized to understand and quantify for better process control. In this work, we have studied a qualitative conformality of metal thin films deposited with E- beam evaporation method. This is very important parameter for realization of MEMS devices, particularly for Through Silicon Via (TSV), MEMS Probe Card and G Switches. In this work, we present detailed qualitative study of metal filling over the bulk micro machined trench patterns and estimate the conformality values with two different types of rotation setup provided in E-beam tool for batch process of MEMS on to the 6” Si wafers.

Keywords

Metal Thin Films, Conformality, Bulk- Micromachined, E- Beam Evaporation Tool.

Full Text

     

P. Ravi Teja Naidu ¹, Vijay Kumar ¹, Jaspreet Singh ¹

Affiliations
1 MEMS Fabrication Division, Department of Space, Semi-Conductor Laboratory, Mohali, IN

Abstract

In this paper, anodic bonding technique at low temperatures with Si-Au-Glass interface has been demonstrated. Also, the techniques to overcome the challenges like gold diffusion/spreading and non-ohmic contacts has been demonstrated. The bond strengths of the anodic bond process is verified through die shear and stud pull tests and observed a good quality bond strength which is better than 10 times in die shear test and 20 times in stud pull test when compared with MIL-Standards.

Keywords

Die Shear, Stud Pull, Anodic Bond, Ohmic Contact.

Full Text